C-pressemuffe kobber blank 16mm2/16mm2 MIL56706101404 Solder removal from Ball Grid

Description

Solder removal from Ball Grid Array (BGA) pads

designed for removing solder using a heated nozzle and vacuum extraction

Funktion: Inkluderer inspektionshul (spy hole) til visuel kontrol

Source: RAACO product page

C-pressemuffe kobber blank 16mm2/16mm2 MIL56706101404 Solder removal from Ball Grid

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
Final sale items are not eligible for returns or exchanges.
To process your return/exchange, please contact us at [email protected]
Please click here for more details>>> Return & Exchange Policy